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ECCO FLUIDFORM™ TECHNOLOGY

Ensures a finely tuned balance of cushioning and rebound of the SD.PU platform and creates an integral, flexible and durable bond without the compromises common with stitched and/or glued assemblies. The inclusion of a T.PU heel guard adds stability.

DIP®

Direct Injection Production (DIP®) bonds the sole to the upper in a single piece,
for a seamless finish that makes each pair feel like an extension of your foot.

DIP®

Direct Injection Production (DIP®) bonds the sole to the upper in a single piece, for a seamless finish that makes each pair feel like an extension of your foot.